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ArticleName Computer simulation of thermal conditions of mold during the crystallization of blister copper ingots
ArticleAuthor Ogorodnikova O. M., Ryabov D. G., Radya V. S.
ArticleAuthorData

Ural Federal University named after the first President of Russia B. N. Yeltsin:

O. M. Ogorodnikova, Assistant Professor of a Chair “Electronic Engineering”, Head of Technological Center of Computer Engineering, e-mail: O.M.Ogorodnikova@bk.ru

 

“Ural Institute of Metals” JSC, Yekaterinburg, Russia:
D. G. Ryabov, Researcher

V. S. Radya, Head of Laboratory, Laboratory of Foundry

Abstract

The urgency of this work is conditioned by the necessity of introduction of modern technologies of Computer-Aided Design, Computer-Aided Engineering and Computer-Aided Manufacturing (CAD, CAE and CAM) into the daily practice of metallurgical production. The molds, used at Sredneuralsky Copper Smelter for obtaining of blister copper ingots, were analyzed by means of CAE. According to the values of thermal imaging unit, there were formulated and verified the boundary conditions of heat transfer through the following surfaces: “mold – ingot”, “mold – environment”, “ingot – environment”. According to the verified model of nonstationary heat transfer, there was carried out the computer calculation of temperature fields in the mold during the crystallization of blister copper. There was created the algorithm of combined analysis of temperature fields and stress-strain states. The computational model, which estimates the distortion and cracking of mold in operating regime, was realized on the layered finite-element mesh. On the stage of analysis of durability, crack-resistance and distortion of mold, the non-stationary and non-uniform temperature fields, calculated on the first stage, were applied as thermal load, causing the internal stresses and residual strains. Results of computer simulation were used for optimization of the mold design. The part of molds with improved design was produced with following experimental exploitation. Average resistance of experimental molds was increased by 15%. More over, the distortion of walls and bottom was not observed after 200 fillings. Thus, computer simulation of thermal conditions of the mold with crystallization of blister copper ingots is an effective tool of improvement of technological processes.

keywords Computer simulation, finite-element method, WinCAST, mold, blister copper, crystallization
References

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