Primary processing of curcuit plate of electronic devices

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Heavy non-ferrous metals
Название	Primary processing of curcuit plate of electronic devices
Автор	Lokshin E. P., Voronchuk S. I., Kuzmich Yu. V., Kovalevsky V. P.
Реферат	The method and device, allowing to process efficiently of circuit plate of electronic devices have been described, with derivation a solder from them, hinged electronic components and organic base with lowered content of non-ferrous metals. Test showed that developed device can be recommended for usage in the process of dismantling of electronic devices.
Ключевые слова	Circuit plate, tin-lead solder, melting temperatures, centrifugal force, thermally insulated carcass, heater, insertion tool, stop inserter, extraction
Language of full-text	русский
Полный текст статьи	Получить