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Heavy non-ferrous metals
ArticleName Primary processing of curcuit plate of electronic devices
ArticleAuthor Lokshin E. P., Voronchuk S. I., Kuzmich Yu. V., Kovalevsky V. P.
Abstract
The method and device, allowing to process efficiently of circuit plate of electronic devices have been described, with derivation a solder from them, hinged electronic components and organic base with lowered content of non-ferrous metals. Test showed that developed device can be recommended for usage in the process of dismantling of electronic devices.
keywords Circuit plate, tin-lead solder, melting temperatures, centrifugal force, thermally insulated carcass, heater, insertion tool, stop inserter, extraction
Language of full-text russian
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